As electronic devices develop towards miniaturization and high integration, the heating problem of PCB (printed circuit board) has become increasingly prominent. Excessive temperature not only affects circuit performance, but may also shorten the life of components and even cause equipment failure. This article will systematically analyze the main reasons for severe heating of PCB boards and provide corresponding solutions.

I. The main reason for PCB heating

1. Design Factors

• Improper wiring：Too thin wires and too long traces will increase resistance and cause heat.
• Insufficient copper foil thickness：Unable to carry large current, resulting in local overheating.
• Improper component layout：High power consumption components are too concentrated, and there is insufficient heat dissipation space.
• Improper via design：Insufficient current carrying capacity or poor heat dissipation channel.

2.Material factors

• Substrate material has poor thermal conductivity：For example, the thermal conductivity of ordinary FR-4 materials is low.
• Poor copper foil quality：Many impurities and uneven thickness lead to increased resistance.
• High dielectric material loss：Dielectric loss generates heat under high-frequency signals.

3. Component factors

• Improper selection of power devices：Internal resistance is too large or rated power is insufficient.
• Component aging：Performance deteriorates and efficiency decreases after long-term use.
• Poor installation of components：Increased contact resistance leads to local heating.

4.Environmental factors

• Ambient temperature is too high：Deterioration of heat dissipation conditions
• Poor ventilation：Heat cannot be dissipated in time
• Too much load：Beyond the design scope

5. Manufacturing process factors

• Poor welding quality：Cold solder joints and cold solder joints increase contact resistance.
• Uneven solder mask：Affects heat dissipation.
• Improper surface treatment：Oxidation causes an increase in contact resistance

II. Solution

1. Optimized design

• Reasonably plan the power supply and ground network to reduce loop impedance.
• Increase copper foil thickness or widen traces to reduce resistance.
• Use thermal simulation software to optimize layout and disperse heat sources.
• Add heat dissipation vias and heat dissipation copper.

2. Material selection

• Choose high thermal conductivity substrate materials, such as metal substrates, ceramic substrates.
• Use thick copper foil (2oz or more) to design high current circuits.
• Choose low-loss dielectric materials for high-frequency applications.

3. Heat dissipation measures

• Add a heat sink or cooling fan.
• Use thermal grease or thermal pads.
• Consider forced air cooling or liquid cooling.
• Optimize the shell design and add ventilation holes.

4. Manufacturing process control

• Strictly control welding process parameters
• Ensure surface treatment quality.
• Perform aging test to screen defective products.

III. Conclusion

PCB heating is a systematic project that requires comprehensive consideration from the aspects of design, materials, processes and use. Through scientific analysis and reasonable improvement measures, the PCB temperature can be effectively controlled to improve the reliability and service life of electronic equipment. In practical applications, targeted solutions should be adopted according to specific circumstances, and thermal simulation tools can be used to optimize the design when necessary.

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