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The Role and Addition Method of Process Edge and MARK Point in PCB Design
Jul 25,2025
I. Why does PCB design require process edges and MARK points? 1. The role of process edge The Fiducial Edge or Process Edge is a blank area reserved at the edge of the PCB, mainly used for: • Production fixture positioning: SMT placement machines and other equipment need to fix the PCB through the process edge to ensure processing accuracy. • Prevent damage to edge components: Avoid direct contact...
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Understanding DFM Checks in PCB Design
Jul 31,2025
1. What is Design for Flow (DFM)? Design for Manufacturability (DFM) involves taking into account factors such as manufacturing processes, costs, and yield during the PCB (Printed Circuit Board) design phase to ensure the design can be produced efficiently and cost-effectively. The goal of DFM is to reduce design defects, improve production efficiency, lower manufacturing costs, and ensure product...
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Reflow Soldering Technology in SMT Assembly
Dec 01,2025
Reflow soldering, as one of the processes in modern electronics PCBA manufacturing, has technical essentials that directly impact the quality and reliability of electronic products. 1. Temperature Profile Design and Control The temperature profile is the core of the reflow soldering process. Typically, it includes preheat zones, temperature hold zones (or activation zones), reflow zones, and cooli...
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